I'm building wearable tech, and the JLCPCB lead times are my biggest bottleneck for iteration. 3-4 weeks is way too long. Has anyone figured out a way to make this quicker? Strongly considering moving to Shenzen to build the prototype. Has anyone done this, and was it quicker/worth it?
Having prototyped in both places I’ll make some arguments for. I’ll preface it’s only worth it if you’re beyond the limits of what American facilities can do and it's a step function in workflow and getting setup. There is an acceptable cultural tunnel vision in our field that developed in the 1980s for "how to do things" and hasn't changed much beyond "4 layer pcb on FR4 with surface mount components" - going against that grain requires an interdisciplinary mindset - as in "make a functioning circuit on a piece of toast" level of creativity[1].
If you’re building wearable tech there’s a strong chance you’ll need to make flex pcbs sooner or later. Those are comically cheap in China and stupid expensive stateside.
Especially when you start pushing the boundaries - there’s so much low hanging fruit for experimenting with your PCBs when you’re in the factory making them. Most US manufacturers will only let you use one color for a solder mask. In Shenzhen we pioneered using full RGB to print any graphic on your pcb back in 2017. Even on top of the chips themselves. It’s now pretty easy to source. This is literally just by being on the factory floor and saying “hey can you do step 5 before you do step 4? - we want to take the boards to this other factory across town first” And they say “sure”. Likewise if you want to mount your parts sideways or upside down to save space. Or say, take a literal sea shell through a copper PVD machine and mill away some traces and mount some chips. They do not care and will gladly take your money and make it happen.
One time we couldn’t find a single vendor in the US or Europe who would embed chips in the middle of pcb layers[2]. This was a weekend project for one of our Chinese vendors - who also had never done this but it sounded like fun so she said “no problem”.
Can get turnaround on prototype boards with assembly for free once you have a cm or just $50 if you don’t. One American vendor comically insisted one couldn’t mix flex and rigid boards for one of our designs for less than $10k. In China it cost me $80. Likewise we mounted chips to non-traditional media like credit cards with no sweat.
Any chip we wanted was available through HQB or TaoBao when Digikey was still backed up on Covid.
Test fixtures (the laser cut jigs that you program and test pcbs) are $100. Stateside they were half as useful and $2000.
You’re one blue Buick minivan ride from Guanzhou where all the garments in the world are made. Being at the intersection of these two cities is a strategic advantage.
Cost of living is cheap.
It will make you a better engineer by exposing you to the dirty business of manufacturing first hand. I'll go so bombastically hyperbolic and say not moving to Shenzhen as an EE is like not moving to Nashville as an aspiring country musician.
In China the saying goes “anything is possible, nothing is easy.” I’d mostly agree with this but also point out that price is completely-orthogonal-to-possible in China, absolutely not in the US, and straight up forbidden in Germany.
[1] https://talk.dallasmakerspace.org/t/breadboard-electronics/1...
[2] https://twitter.com/pmg/status/1248148053795540992/photo/1
p.s. If you enjoyed this comment, you may also enjoy my "So you want to start a factory?" reply on a post from a few days ago [3]
[3] https://news.ycombinator.com/item?id=40001222
OSH Park does flex:
https://docs.oshpark.com/services/flex/
For some data, in 2019 about 3 million Americans went to China and the number detained for political reasons (and not working for the US government or journalism) was probably in the single digits?
In the US I've driven about 600,000 miles and been in one traffic accident. In China I've ridden about 30,000 miles and been in 6 traffic accidents.
Plenty of other things people have gone on at length about things that are just different risks in both places.
I miss Naomi's tweets!
1. Figure out if you can do fewer slow iterations. What's driving the need for a full PCBA run for each iteration? Might be able to split out to rigid assembly and flex for example.
2. Run more experiments in parallel. If you have multiple ideas or variations to test, design them all and fabricate them all. Flex antenna? Make like 30 parametric variations.
If design then becomes the bottleneck, then automate that next.
Then just glomp the flex down to the test PCB with some nice Samtec connectors (you can enough free samples for a small batch of test units even) or an edge connector on the stiffener.
Don't move to Shenzhen. You don't have the social connections for that and it'd just give you a bunch of new problems.
You don't get many engineer hours for $100.
[0] https://www.pcbtrain.co.uk/
To answer your specific question, Shenzhen is a good place to work on hardware, but it is not like you just fly in, and people start building for you. Your own lead time (establishing yourself there) will likely be in weeks if not months. This is from my personal experience in Shenzhen and other hardware founders'.
If you want to build the prototype faster, identifying the bottleneck is a great start. Which takes most time? For up to medium complexity, PCB fab (the board itself) is the most time-consuming part. Anything more complex, it could be the SMT assembly. Each part of the entire process can be optimized: PCB fab can be done in-house quick (chemical etching, CNC machining, etc). Assembly can be optimized too (solder reflow oven, solder paste stencils, etc) on a small scale. I would estimate a batch of 5 boards of 50 SMT components each can be produced under 8 active engineer-hours. That's your entire prototype in a work day.
Do you have professional/academic training in electrical engineering? EE is no less complex than CS, and perhaps studying up the entire process will help you identify what's possible and what's the bottleneck.
Far less! That's about how many boards of similar complexity I could hand-stuff and reflow in an hour!
I just don’t think this really is a better way of doing things.
Also, really take a look at JLC's component prices and compare them. Some of their markup, namely for ICs, is borderline criminal.
If you’re bootstrapping, find a good quick turn board house and assemble the boards yourself. Get an lga-12 stencil and hot air tools, maybe a benchtop reflow oven.
That seems like a profoundly personal decision that would have more ramifications than you expect.
Breadboarding should be possible, same with soldering together prototype PCBs as long as you're not concerned with wearing the prototype yourself. There's also (albeit expensive) circuit modelling/validation software you could try to use. I don't think many circuit designers have a workflow where they perpetually buy finished prototypes to check if they're working or not, though.
You'll be limited to single or double sided, without vias but considering its rapid prototyping, these are the compromises to be had.
You could always try CNCing prototypes but this is fraught with trouble. Fiber lasers offer the simplicity, repeatability and speed that normal laser cuters, but with metal.
[0] https://www.youtube.com/watch?v=PoYcjyghDx4