Interesting thread.
I had heard similar cautions about ultrasonic cleaning with certain MEMS sensors, but I didn't realize the same concern could apply to exposed-die CMOS sensors as well.
Is the main risk the resonance frequencies of the bond wires, or more about mechanical stress propagating through the package?
If computation can happen directly on encrypted data, does that reduce the need for trusted environments like SGX/TEE, or does it mostly complement them?